Where to Buy Packaging of Optoelectronic Modules
For the practical application of optoelectronic and photonic integrated circuits, for example, proper packaging of the used components is a vital aspect. It affects the convenience of use, the robustness and durability.
Related products: optoelectronic components and devices
Related product category: various devices
E | Related encyclopedia articles: optoelectronics, photonic integrated circuits |
4 suppliers for packaging of optoelectronic modules are listed in the RP Photonics Buyer's Guide. Both manufacturers and distributors can be registered.
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Suppliers with Ad Package presenting their product descriptions | |
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Company | Product Description |
![]() Packaging foundry for PIC-based optoelectronic modules High Tech Factory – building 46 De Veldmaat 17 7522 NM Enschede Netherlands ![]() Facebook LinkedIn Twitter YouTube E-mail: (See the company profile page for additional contact information.) | ![]() Assembling your PICs into functional modules in scalable volumes is PHIX’s core expertise. We have a broad experience in designing and assembling modules for telecommunications, industrial, automotive, medical, space and defense applications. We support all major material platforms, such as silicon photonics, SiN, InP and PLC, and can even co-package multiple PIC technologies into one product. We can also provide hermetic sealing for your module. |
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All Suppliers | |
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From your country: | |
1260 Calle Suerte Camarillo, CA 93012 United States | |
Outside America: | |
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM) Abt. SIIT/Optical Interconnection Technology Gustav-Meyer-Allee 25 13355 Berlin Germany | |
![]() Packaging foundry for PIC-based optoelectronic modules High Tech Factory – building 46 De Veldmaat 17 7522 NM Enschede Netherlands ![]() Facebook LinkedIn Twitter YouTube E-mail: (See the company profile page for additional contact information.) | ![]() Assembling your PICs into functional modules in scalable volumes is PHIX’s core expertise. We have a broad experience in designing and assembling modules for telecommunications, industrial, automotive, medical, space and defense applications. We support all major material platforms, such as silicon photonics, SiN, InP and PLC, and can even co-package multiple PIC technologies into one product. We can also provide hermetic sealing for your module. |
Hattenbergstr. 10 55122 Mainz Germany | |
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