Buying Photonic Integrated Circuits
Photonic integrated circuits (PICs), also known as planar lightwave circuits, integrate several or many optical (and often electronic) components. They are applied in telecom systems and other fields requiring compact, efficient optical integration.
Making Good Purchase Decisions
As the most professional photonics purchasing portal, RP Photonics helps you to not only to find all relevant suppliers (not limited to our advertisers), but also to make good purchasing decisions.
NEW: Structured Decision Process
Purchasing involves a lot of responsibility. We recommend that you apply best practice by using the following structured process: Go through the following expandable sections, complete the form and finally come to a purchase decision. You can then print that to a PDF for documenting the process.
Our article on best practices for purchasing and another one explaining this tool give you valuable insights.
Suppliers for Photonic Integrated Circuits
17 suppliers for photonic integrated circuits (PIC) are listed in the RP Photonics Buyer's Guide, out of which 2 present their product descriptions. Both manufacturers and distributors can be registered.
Suppliers with Advertising Package
presenting their product descriptions
![]() Composing with Light Teem Photonics S. A.61 chemin du Vieux Chêne 38246 Meylan France See us at OFC 2025 in San Francisco, April 1–3 (booth 6384)! | ![]() Teem Photonics offers Photonics Integrated Circuit (PIC) solutions based on its reliable, versatile and cost effective ioNext platform. Time from design-end to chip delivery is an industry best with as short as 4 weeks turn-around time. The specific ion-exchange process enables waveguide confinement to be varied on chip. These lead to innovative WAFT series solutions for interfacing fiber arrays with silicon photonics. The ioNext technology also allows functions such as splitters, couplers, taps, mux/demux, polarizers and custom devices which can be pigtailed to SM or PM fibers. Product-specific web page |
![]() Packaging foundry for PIC-based optoelectronic modules PHIX Photonics AssemblyHengelosestraat 525 7521 AG Enschede The Netherlands See us at OFC 2025 in San Francisco, April 1–3 (booth 6266)! | ![]() PHIX has developed several packaging solutions that allow for convenient, quick and affordable prototyping of your first photonic integrated circuits (PICs). They provide a housing with electrical connections, optical interfaces, and thermal management. Hybrid assembly of auxiliary chips is also supported. Each of our standard housings have characteristics that favor certain chip dimensions and system configurations. However, if you have special requirements, we are happy to design a customized prototype package for you. Product-specific web page |
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Other Suppliers
AEPONYX Inc. Canada |
Allwave Lasers Devices Inc. China |
Bright Photonics BV Netherlands |
Crisel Instruments s.r.l. Italy |
Dream Photonics Inc. Canada |
EFFECT Photonics Netherlands |
Fraunhofer Institute for Telecommunications Germany |
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM) Germany |
LIGENTEC SA Switzerland |
Lightelligence, Inc. United States |
LioniX International BV Netherlands |
Modular Photonics Australia |
SMART Photonics Netherlands |
Vanguard Automation GmbH Germany |
VLC Photonics S.L. Spain |