Packaging foundry for PIC-based optoelectronic modules
High Tech Factory – building 46
De Veldmaat 17
7522 NM Enschede
|Tel.:||+31 53 483 6850|
|Social media:||Facebook LinkedIn Twitter YouTube|
PHIX is an independent packaging and assembly OSAT for photonic integrated circuits (PICs) located in Enschede, The Netherlands. We support all major PIC technology platforms (like indium phosphide, silicon photonics, silicon nitride, and planar lightwave circuit) and are specialized in hybrid integration of chip-to-chip and fiber-to-chip modules. PHIX provides a one-stop-shop for PIC assembly, from design to manufacturing, in scalable production volumes.
Qmode project with QuiX
QuiX and PHIX started a collaboration in the project Qmode to overcome the packaging challenges of connecting large-scale quantum photonic processors to the outside world.
Within the Qmode project, QuiX and PHIX work together to connect a large quantum photonic processor of 50 input/output modes to the outside world. This involves more than 100 optical fiber connections, up to 5000 electrical connections, and new challenges in heat dissipation. Consequently, new techniques are required that push the limits of the current state of the art in integrated photonics packaging and assembly.
Large-scale (50 modes) and fully reconfigurable quantum photonic processors are needed to demonstrate a real advantage of photonic quantum computers over classical supercomputers. Photonic quantum computing is attracting increasing attention as an alternative platform to quantum computers using other types of qubits such as, e.g., superconducting qubits. As these photonic processors scale to sizes involving thousands of tunable elements and hundreds of optical modes, new challenges arise in the packaging of these chips to connect them to surrounding components.
The Qmode project is funded with an MIT-R&D collaboration project grant from the Provincie Overijssel, dedicated to stimulate the innovation and development of products, processes and services of local SMEs working in the Dutch Top Sectors. The collaboration established in Qmode will help QuiX secure a leading position in the market for photonic quantum computing, while PHIX expands its expertise and services in the packaging and assembly of large photonic chips. The Qmode project reinforces the centrality of the Provincie Overijssel in the Dutch photonics landscape by recognizing and supporting the development of the innovative technologies developed by QuiX and PHIX.
PhiX in the Virtual Exhibition
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News: PHIX and ficonTEC partner to enable high-volume manufacturing of multi-chip photonic modules.
Video: Introduction to PHIX
Star product: Large area goldbox package.
If you want to outsource your assembly process or you’re looking for a secondary supplier of your own manufacturing, we're your trusted partner and scale with your growth. Our engineering team can validate what is required for a safe launch transfer and decide together how to release our packaging foundry for your product. We're happy to support you by performing dedicated steps of your production on our equipment. Here we offer services for die bonding, wire bonding, hybrid assembly, fiber attach, testing etc.
|design and development services|
PHIX has developed several packaging solutions that allow for convenient, quick and affordable prototyping of your first photonic integrated circuits (PICs). They provide a housing with (RF) electrical connections, optical interfaces, and thermal management. Hybrid assembly of auxiliary chips is also supported. Housing types include our PHIX Characterization Package, PIXAPP Characterization Package, Butterfly Package and Large Area Goldbox.
PHIX Photonics Assembly offers a broad range of V-groove fiber arrays for photonic integrated circuit (PIC) connections which are used in telecommunication networks, medical equipment, space and military applications, as well as test and measurement equipment. With our extensive experience in connecting fiber arrays to PICs for various platforms like Silicon Nitride, Silicon Photonics, and Indium Phosphide, we are your partner in the selection and supply of high-quality V-groove fiber arrays.
|fiber mode field adapters||E|
Spot size converters (SSCs) provide an efficient coupling from arrays of optical fibers to photonic integrated circuits (PICs). They reduce the mode field using lithographically defined waveguides. PHIX offers V-groove fiber arrays with a pre-attached spot size converter.
|packaging of optoelectronic modules|
Assembling your PICs into functional modules in scalable volumes is PHIX’s core expertise. We have a broad experience in designing and assembling modules for telecommunications, industrial, automotive, medical, space and defense applications. We support all major material platforms, such as silicon photonics, SiN, InP and PLC, and can even co-package multiple PIC technologies into one product. We can also provide hermetic sealing for your module.
|photonic integrated circuits||E|
PHIX has developed several packaging solutions that allow for convenient, quick and affordable prototyping of your first photonic integrated circuits (PICs). They provide a housing with electrical connections, optical interfaces, and thermal management. Hybrid assembly of auxiliary chips is also supported. Each of our standard housings have characterics that favor certain chip dimensions and system configurations. However, if you have special requirements, we are happy to design a customized prototype package for you.
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