Packaging foundry for PIC-based optoelectronic modulesPhiX Photonics Assembly
High Tech Factory – building 46
De Veldmaat 17
7522 NM Enschede
|Tel.:||+31 53 483 6850|
|Social media:||Facebook LinkedIn Twitter YouTube|
PHIX is an independent packaging and assembly OSAT for photonic integrated circuits (PICs) located in Enschede, The Netherlands. We support all major PIC technology platforms (like indium phosphide, silicon photonics, silicon nitride, and planar lightwave circuit) and are specialized in hybrid integration of chip-to-chip and fiber-to-chip modules. PHIX provides a one-stop-shop for PIC assembly, from design to manufacturing, in scalable production volumes.
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News: PHIX updates its characterization package development platform for photonic integrated circuits.
Video: Introduction to PHIX
Star product: Large area goldbox package.
If you want to outsource your assembly process or you’re looking for a secondary supplier of your own manufacturing, we're your trusted partner and scale with your growth. Our engineering team can validate what is required for a safe launch transfer and decide together how to release our packaging foundry for your product. We're happy to support you by performing dedicated steps of your production on our equipment. Here we offer services for die bonding, wire bonding, hybrid assembly, fiber attach, testing etc.
|design and development services||S|
PHIX has developed several packaging solutions that allow for convenient, quick and affordable prototyping of your first photonic integrated circuits (PICs). They provide a housing with (RF) electrical connections, optical interfaces, and thermal management. Hybrid assembly of auxiliary chips is also supported. Housing types include our PHIX Characterization Package, PIXAPP Characterization Package, Butterfly Package and Large Area Goldbox.
|fiber arrays||S E|
PHIX Photonics Assembly offers a broad range of V-groove fiber arrays for photonic integrated circuit (PIC) connections which are used in telecommunication networks, medical equipment, space and military applications, as well as test and measurement equipment. With our extensive experience in connecting fiber arrays to PICs for various platforms like Silicon Nitride, Silicon Photonics, and Indium Phosphide, we are your partner in the selection and supply of high-quality V-groove fiber arrays.
|fiber mode field adapters||S E|
Spot size converters (SSCs) provide an efficient coupling from arrays of optical fibers to photonic integrated circuits (PICs). They reduce the mode field using lithographically defined waveguides. PHIX offers V-groove fiber arrays with a pre-attached spot size converter.
See also our white paper on PHIX Spot Size Converters (SSCs)!
|packaging of optoelectronic modules||S|
Assembling your PICs into functional modules in scalable volumes is PHIX’s core expertise. We have a broad experience in designing and assembling modules for telecommunications, industrial, automotive, medical, space and defense applications. We support all major material platforms, such as silicon photonics, SiN, InP and PLC, and can even co-package multiple PIC technologies into one product. We can also provide hermetic sealing for your module.
|photonic integrated circuits||S E|
PHIX has developed several packaging solutions that allow for convenient, quick and affordable prototyping of your first photonic integrated circuits (PICs). They provide a housing with electrical connections, optical interfaces, and thermal management. Hybrid assembly of auxiliary chips is also supported. Each of our standard housings have characteristics that favor certain chip dimensions and system configurations. However, if you have special requirements, we are happy to design a customized prototype package for you.
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