PhiX

If you want to outsource your assembly process or you’re looking for a secondary supplier of your own manufacturing, we're your trusted partner and scale with your growth. Our engineering team can validate what is required for a safe launch transfer and decide together how to release our packaging foundry for your product. We're happy to support you by performing dedicated steps of your production on our equipment. Here we offer services for die bonding, wire bonding, hybrid assembly, fiber attach, testing etc.

PHIX has developed several packaging solutions that allow for convenient, quick and affordable prototyping of your first photonic integrated circuits (PICs). They provide a housing with (RF) electrical connections, optical interfaces, and thermal management. Hybrid assembly of auxiliary chips is also supported. Housing types include our PHIX Characterization Package, PIXAPP Characterization Package, Butterfly Package and Large Area Goldbox.

PHIX Photonics Assembly offers a broad range of V-groove fiber arrays for photonic integrated circuit (PIC) connections which are used in telecommunication networks, medical equipment, space and military applications, as well as test and measurement equipment. With our extensive experience in connecting fiber arrays to PICs for various platforms like Silicon Nitride, Silicon Photonics, and Indium Phosphide, we are your partner in the selection and supply of high-quality V-groove fiber arrays.

Spot size converters (SSCs) provide an efficient coupling from arrays of optical fibers to photonic integrated circuits (PICs). They reduce the mode field using lithographically defined waveguides. PHIX offers V-groove fiber arrays with a pre-attached spot size converter.

Assembling your PICs into functional modules in scalable volumes is PHIX’s core expertise. We have a broad experience in designing and assembling modules for telecommunications, industrial, automotive, medical, space and defense applications. We support all major material platforms, such as silicon photonics, SiN, InP and PLC, and can even co-package multiple PIC technologies into one product. We can also provide hermetic sealing for your module.

PHIX has developed several packaging solutions that allow for convenient, quick and affordable prototyping of your first photonic integrated circuits (PICs). They provide a housing with electrical connections, optical interfaces, and thermal management. Hybrid assembly of auxiliary chips is also supported. Each of our standard housings have characteristics that favor certain chip dimensions and system configurations. However, if you have special requirements, we are happy to design a customized prototype package for you.